Wanli Li

Wanli Li

PhD student, Osaka University

Presentation Title:

Low temperature curable Cu-Ag hybrid inks to balance the cost and stability of printed conductive patterns

Time: TBD

Presentation Abstract:

Wanli Li (1,*) , Linying Li (1) , Bowen Zhang (1) , Cai-Fu Li (1) , Jinting Jiu (1) , and Katsuaki Suganuma (1) (1) The Institute of Scientific and Industrial Research (ISIR), Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, JAPAN.

Printable materials are the foundation of printed electronics, and especially printable conductive materials (also called conductive inks) can be used to print various conductivepatterns which are main components of electronic devices. In the past decade, Ag inks and Cu ink have been studied for fabrication of highly conductive patterns on various substrates. However, both of them have some advantages and disadvantages. Ag inks are easily sintered and give printed patterns a high conductivity and a high stability in air, while their relatively high cost and poor chemical migration resistance are likely to hinder their wide applications in printed electronics. In contrast, Cu inks are relatively cheap and endow printed patterns high conductivity as well as a higher chemical migration resistance. However, Cu inks are not stable due to the oxidation of Cu particles and sintered Cu patterns are still easily oxidized, which decrease the conductivity of printed patterns [1]. In this presentation, two kinds of Cu-Ag hybrid inks will be introduced to balance the cost and stability of printed conductive patterns. The first one, made from Cu complex and Ag complex, can be used to create highly conductive Cu-Ag hybrid patterns (2.80×10 -5 Ω·cm) even at temperatures below 100 ºC, which is beneficial for applications on the heat-sensitive substrates [2]. The second one is made from Cu particles and Ag complex, which can be used to create high oxidation-resistant and flexible Cu-Ag alloy patterns, maintaining stable even at a high temperature of 180 ºC in air [3].

[1] W. Li, L. Li, Y. Gao, D. Hu, C.-F. Li, H. Zhang, J. Jiu, S. Nagao and K. Suganuma, J. Alloys Compd. 732, 240 (2018). [2] W. Li, C.-f. Li, F. Lang, J. Jiu, M. Ueshima, H. Wang, Z.-Q. Liu and K. Suganuma, Nanoscale 10, 5254 2018. [3] W. Li, D. Hu, L. Li, C.-F. Li, J. Jiu, C. Chen, T. Ishina, T. Sugahara and K. Suganuma, ACS Appl. Mater. Interfaces 9, 24711 (2017).


I focuse on the research about printed electronics, especially the development of Cu-based inks, which can be used to create highly conductive and stable pattern on various flexible substrates. In addition, I am interested in the research about stretchable electronics.

Company Profile:

Osaka University is a national university located in Osaka, Japan.