Journal of Imaging
Science and Technology / ICFPE2018

Call for Papers

Special Issue on Emerging Technologies in Flexible and




Printing technology
is widely used for printing of newspaper, packaging foils etc. and is known to
have high throughput. Recently, printing fabrication has been increasingly
explored for other applications such as “Printed Electronics” which is rapidly
advancing from research and inventions to commercialization and products.
However, there are still vibrant debates about the advantages of the printed
electronics over current Si based electronics in terms of the process cost and
the device performance. Nevertheless, the printed electronics is still very
promising novel manufacturing technologies for many applications and represents
multi-billion dollars market, which will change our world enabling a variety of
innovative products made from low cost electronic paper or plastic film, such as:
(i) electronic clothing, lighting, books, (ii) the biodegradable and disposable
mobile phone, iPod and laptop, (iii) cars that glow in the dark, (iv)
billboard, poster, airport screen, packet of drugs and shelf sign with color
display, etc.

The 9th
International Conference on Flexible and Printed Electronics, ICFPE 2018, will
be held from September 25-28, 2018 in Changzhou, China, and is co-located with
the 8th Chinese National Symposium on Flexible and

Electronics, Flexible Electronics Summit 2018 and Flex China 2018. ICFPE is an
Asia-based global conference which highlights challenges, emerging processes
and applications in printing process, materials and devices. It will cover a
broad range of topics in this field and focus on novel processes, novel
materials and devices, enabled or constrained particularly by the nature of
printing processing. 

This special issue
will bring together leading scientists, researchers, and scholars in the domain
of interest, and cover such research topics as fundamental science,
manufacturing processes, and industrial applications in relevant areas of
flexible and electronic printing technologies. Submission guidelines can be
found in All
submitted papers will be reviewed by two to three reviewers and selected based
on their originality, significance, relevance, and clarity of presentation. The
cover letter should indicate the names of the authors and their affiliations,
addresses, faxes, and e
mails. The authors
should submit full manuscripts electronically via, by

December 30, 2018.


The topics for special issue include,
but are not limited to the following fields:

       Material and Technologies

o    Substrate Material, Barrier Film, Encapsulation Transparent
Conductive Films,

Conductive Inks, 2D Material, Device
Physics & Circuit Design, Electrical

Measurement & Evaluation

       Manufacturing Processes

o    Additive manufacturing, Hybrid manufacturing, Commercialization,
Measurement and Reliability

       Display and Lighting

o    OLED, Electrophoretic, Electrochromic, Electroluminescent, Flexible
LCD, OLED, Printed LED


o    Biomedical, Touch, Temperature, Pressure, Image, Gas


o    Photovoltaics, Crystalline Silicon PV, Thin Film PV, Energy Storage,

Energy Harvesting


Important Dates:

Submission deadline: December. 30,

First-Round review date: March 30,

Submission of revised version: May
30, 2019

Notification of acceptance: June 15,

Camera-ready due: July 30, 2019

Publication date: T.B.D.


Guest Editors:

       Dr. Xiachang Zhang

o    President, Changzhou Institute of Printed Electronics Industry,



       Professor Zheng Cui

o    Director, Printable Electronics Research Center (PERC)Suzhou
Institute of  Nano-Tech &
Nano-Bionics, Chinese Academy of Sciences, China



       Professor Luhai Li

o    Director, Beijing Engineering Research Center of Printed Electronics,
Beijing Institute of Graphic Communication, China



       Dr. Jie Zhang

o    Vice President, Changzhou Institute of Printed Electronics Industry,


       Professor Xiaojun Guo

o    Shanghai Jiao Tong University




Page Charge:                                                                                                                                                                 

         Page charges in the amount of US$80/page in support of the
Journal publication and as agreed by the authors at the submission of the
paper, are due by date of publication. 

Printable Functional Materials and Printed Electronic Applications


About this Research Topic

Owing to their capacity to bypass conventional high-priced and inflexible silicon-based electronics to manufacture a variety of devices on flexible substrates by using large-scale and high-volume printing techniques, printed electronics (PE) have attracted increasing attention in the manufacturing industry for electronic devices. This simple and cost-effective approach can enhance current methods of constructing a patterned surface for printable functional materials and offer opportunities for developing fully-printed functional devices, especially offering the possibility of ubiquitous low-cost and flexible devices. PE technology is employed and used in various applications, including conductive tracks, circuits and electrodes, energy conversion and storage devices (solar cells, capacitors, etc.), flexible displays, sensors, printed field-effect transistors (FETs), as well as intelligent and interactive packaging, etc.

This Research Topic is intended to publish contributions investigating all aspects of printable functional materials and printed electronic applications. The scope of the project is to provide a platform for exchanging ideas, disseminating important advances, and sharing visions and concepts in the rapidly-evolving field of advanced printable materials and printed electronics. Therefore, we welcome printing related submissions of research papers with novel data (both experimental and modelling) on themes including, but not limited to, the following:

 • Printable organic materials
 • Printable inorganic materials
 • Printable soft and hybrid material systems
 • Functional printable inks: formulation, rheology, ink surface interaction
 • Advanced fabrication and printing techniques
 • Printed tracks, circuits, and electrodes
 • Printed electronic devices and applications
 • Printed energy devices and harvesting systems
 • Printed sensors

Keywords: Printable Materials, Printed Electronics, Functional Inks, Flexible Electronics, Printing Technology

Important Note: All contributions to this Research Topic must be within the scope of the section and journal to which they are submitted, as defined in their mission statements. Frontiers reserves the right to guide an out-of-scope manuscript to a more suitable section or journal at any stage of peer review.

Submit your abstract here

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Topic Editors

Wu Wei

Wuhan University

Wuhan, China